Achievements, Computational Science, Education and Training, Research, Supercomputing

Columbus, Ohio (July 12, 2018) – The Ohio Supercomputer Center’s (OSC) Karen Tomko, Ph.D., and the University of Illinois/Urbana’s Robert Dodds, Ph.D., recently wrapped up a project that will greatly enhance the simulation capabilities of manufacturing engineers.  

COLUMBUS, Ohio (April 6, 2018) — The demand for high performance computing in Ohio is relentless, and it does not discriminate by field.  At Thursday’s Ohio Supercomputer Center Statewide Users Group (SUG) spring conference, OSC clients in fields spanning everything from astrophysics to linguistics gathered to share research highlights and hear updates about the center’s direction and role in supporting

The Ohio Supercomputer Center recently displayed the power of its new Owens Cluster by running the single-largest scale calculation in the Center’s history.

Scientel IT Corp used 16,800 cores of the Owens Cluster on May 24 to test database software optimized to run on supercomputer systems. The seamless run created 1.25 Terabytes of synthetic data. For the full story, please see OSC's website.

Research using Ohio Supercomputer Center resources continues to break new ground, and OSC clients continue to gain more high performance computer power and a better experience.

Nearly 100 attendees gathered at the Ohio Technology Consortium building for the conference, which featured a keynote address from NVIDIA’s Jonathan Bentz, breakout sessions on a variety of topics and the ever-popular poster and flash talk competitions. Participants presented 24 posters and 10 flash talks with winners receiving 5,000 resource units of time on OSC systems while runners-up gained 2,500 resource units.

While many college students spend their summer studying abroad or taking courses, a handful from Ohio have been spending their summer break learning the ropes of a high-tech environment.

A team of academic and business organizations, mostly from Ohio, won an award for the “Best Application for Advanced Manufacturing” at the Next Generation Application Summit.